Micromachines
Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements.
Mamta Dhyani, Tsuriel Avraham, Joseph B Bernstein, Emmanuel Bender
Published: 202610.3390/mi17010088
Abstract
This work examines resistance drift in FPGA I/O paths subjected to combined electrical and thermal stress, using a Xilinx Spartan-6 device as a representative platform. A multiplexed measurement approach was employed, in which multiple I/O pins were…
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