Nanoscale horizons
Surface-enhanced thermal dissipation in 3D vertical resistive memory arrays with top selector transistors.
Arman Kadyrov, Seunghyun Lee, Batyrbek Alimkhanuly, Shubham Patil, Anupom Devnath, Junseong Bae, Minwoo Lee, Jinsu Choi, Gisuk Hwang, Seunghyun Lee
Published: 202610.1039/d5nh00653h
Abstract
Recent integration of 3D memory technologies such as high-bandwidth memory [HBM] into AI accelerators has enhanced neural network performance. However, the stacked structures of 3D memories result in notable heat accumulation because lateral interfac…
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