Advances in colloid and interface science
Electrospinning of thermal interface materials.
Xiachen Xiao, Baoshan Xie, Liangxuan Ouyang, Juefei Yang, Chengshuai Li, Jing Zhao, Youfu Lv, Xiaoliang Zeng, Chuanchang Li
Published: 202510.1016/j.cis.2025.103754
Abstract
As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabric…
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