Small (Weinheim an der Bergstrasse, Germany)
Mechanically Robust and Anti-Biofouling Hybrid Encapsulation via Layered Organic-Liquid Interfaces for Implantable Devices.
Sangwoo Park, Kijun Park, Tae Young Kim, Yejin Jo, Jangho Kim, Kayoung Son, Hayoung Choi, Myoung-Ryul Ok, Su Ryon Shin, Jungmok Seo
Published: 202610.1002/smll.202510949
Abstract
Implantable bioelectronic devices, due to their prolonged contact with biological tissues, face persistent challenges including moisture permeation, mechanical deformation, and biofouling. Traditional encapsulation strategies using either inorganic o…
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