Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding.
Gangqiang Peng, Xinyi Dong, Binzhao Li, Chuan He, Cong Chen, Licheng Huang, Jian Liu, Yonghan Zhou, Qikai Li, Hao Gong, Yuechen Wang, Kaiyu Mu, Sheng-Jye Cherng, Po-Yen Yang, Yang Lu
Published: 202610.1002/advs.202521964
Abstract
Nanograined copper (ng-Cu) attracts interest in advanced electronic packaging due to its grain boundary-mediated fast diffusion, enabling low-temperature copper-to-copper (Cu-Cu) bonding. However, after electroplating ng-Cu, self-grain growth at room…
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