Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Small and Simple Molecular Structure Based Thermally Stable Ruthenium Precursor in Advancing Ruthenium ALD Process for Scaled Interconnect Metallization.
Hideaki Nakatsubo, Debananda Mohapatra, Eun-Soo Lee, Jeongha Kim, Iaan Cho, Masato Iseki, Toshiyuki Shigetomi, Ryosuke Harada, Sang-Woong Na, Taehoon Cheon, Bonggeun Shong, Soo-Hyun Kim
Published: 202510.1002/advs.202519209
Abstract
Ruthenium (Ru) via atomic layer deposition (ALD) has emerged as a promising alternative to copper-interconnects. For the first time, a small yet simple molecular structure Ru precursor, [Ru(trimethylenemethane (TMM))(p-cymene)], with excellent therma…
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